Sabbin asali na asali na IC kayan lantarki Kayan Wuta Ic Chip Support BOM Sabis TPS22965TDSGRQ1
Halayen Samfur
| TYPE | BAYANI |
| Kashi | Haɗin kai (ICs) |
| Mfr | Texas Instruments |
| Jerin | Mota, AEC-Q100 |
| Kunshin | Tape & Reel (TR) Yanke Tape (CT) Digi-Reel® |
| Matsayin samfur | Mai aiki |
| Nau'in Canjawa | Babban Manufar |
| Adadin abubuwan da aka fitar | 1 |
| Ratio - Shigarwa: Fitarwa | 1:1 |
| Kanfigareshan fitarwa | Babban Side |
| Nau'in fitarwa | N-Channel |
| Interface | Kunna/Kashe |
| Voltage - Load | 2.5 ~ 5.5V |
| Ƙarfin wutar lantarki - Kayan aiki (Vcc/Vdd) | 0.8V ~ 5.5V |
| Yanzu - Fitowa (Max) | 4A |
| Rds Kunna (Nau'i) | 16mh ku |
| Nau'in shigarwa | Rashin Juyawa |
| Siffofin | Fitar da Load, Ana Sarrafa Matsaloli |
| Kariyar Laifi | - |
| Yanayin Aiki | -40°C ~ 105°C (TA) |
| Nau'in hawa | Dutsen Surface |
| Kunshin Na'urar Mai bayarwa | 8-WSON (2x2) |
| Kunshin / Case | 8-WFDFN Faɗakarwar Kushin |
| Lambar Samfurin Tushen | Saukewa: TPS22965 |
Menene marufi
Bayan dogon tsari, daga ƙira zuwa ƙira, a ƙarshe kun sami guntu IC.Duk da haka, guntu yana da ƙanƙanta kuma sirara ta yadda za a iya toshe shi cikin sauƙi da lalacewa idan ba a kiyaye shi ba.Bugu da ƙari, saboda ƙananan girman guntu, ba shi da sauƙi a sanya shi a kan allo da hannu ba tare da babban gidaje ba.
Saboda haka, bayanin kunshin ya biyo baya.
Akwai nau'ikan fakiti guda biyu, kunshin tsoma baki, wanda aka saba samu a cikin kayan wasa na lantarki kuma yayi kama da santi a baki, kuma kunshin BGA, wanda aka saba samu lokacin sayen CPU a cikin akwati.Sauran hanyoyin marufi sun haɗa da PGA (Pin Grid Array; Pin Grid Array) da aka yi amfani da su a farkon CPUs ko ingantaccen sigar DIP, QFP (kunshin fakitin murabba'in filastik).
Saboda akwai hanyoyi daban-daban na marufi, masu zuwa zasu bayyana fakitin DIP da BGA.
Fakitin gargajiya waɗanda suka dawwama tsawon shekaru
Kunshin farko da za a gabatar shine Kunshin Inline Dual (DIP).Kamar yadda kuke gani daga hoton da ke ƙasa, guntu na IC a cikin wannan kunshin yana kama da baƙar fata centipede a ƙarƙashin jeri biyu na fil, wanda ke da ban sha'awa.Duk da haka, saboda yawanci an yi shi da filastik, tasirin zubar da zafi ba shi da kyau kuma ba zai iya biyan bukatun kwakwalwan kwamfuta masu sauri na yanzu ba.Don wannan dalili, yawancin ICs da aka yi amfani da su a cikin wannan fakitin kwakwalwan kwamfuta ce mai dorewa, kamar OP741 a cikin zanen da ke ƙasa, ko ICs waɗanda ba sa buƙatar saurin gudu kuma suna da ƙananan kwakwalwan kwamfuta tare da ƙarancin vias.
guntu IC a gefen hagu shine OP741, amplifier na yau da kullun.
IC na hagu shine OP741, amplifier na yau da kullun.
Dangane da kunshin Ball Grid Array (BGA), ya fi ƙarami fiye da kunshin DIP kuma yana iya shiga cikin ƙananan na'urori cikin sauƙi.Bugu da ƙari, saboda fil ɗin suna ƙarƙashin guntu, ƙarin fitilun ƙarfe za a iya saukar da su idan aka kwatanta da DIP.Wannan ya sa ya dace don kwakwalwan kwamfuta waɗanda ke buƙatar babban adadin lambobin sadarwa.Koyaya, ya fi tsada kuma hanyar haɗin kai ta fi rikitarwa, don haka galibi ana amfani da ita a cikin kayayyaki masu tsada.
