IC guntu gazawar bincike

IC guntu gazawar bincike,ICguntu hadedde da'irori ba zai iya guje wa kasawa a cikin aiwatar da ci gaba, samarwa da amfani.Tare da haɓaka buƙatun mutane don ingancin samfur da aminci, aikin binciken gazawar yana ƙara zama mai mahimmanci.Ta hanyar binciken gazawar guntu, guntu IC na masu zanen kaya na iya samun lahani a cikin ƙira, rashin daidaituwa a cikin sigogin fasaha, ƙira mara kyau da aiki, da sauransu.

A cikin daki-daki, babban mahimmancinICAna nuna nazarin gazawar guntu a cikin waɗannan bangarorin:

1. Binciken gazawa hanya ce mai mahimmanci da hanya don ƙayyade tsarin gazawar kwakwalwan IC.

2. Binciken kuskure yana ba da mahimman bayanai don ingantaccen ganewar kuskure.

3. Binciken gazawa yana ba da injiniyoyin ƙira tare da ci gaba da haɓakawa da haɓaka ƙirar guntu don biyan bukatun ƙayyadaddun ƙira.

4. Binciken gazawa na iya kimanta tasirin hanyoyin gwaji daban-daban, samar da abubuwan da ake buƙata don gwajin samarwa, da samar da mahimman bayanai don haɓakawa da tabbatar da tsarin gwaji.

Babban matakai da abubuwan da ke cikin binciken gazawar:

◆ Hadakar da'ira kwancewa: Yayin cire hadedde da'ira, kula da mutuncin guntu aikin, kula mutu, bondpads, bondwires har ma da gubar-frame, da kuma shirya na gaba guntu invalidation bincike gwaji.

◆ SEM madubin dubawa / EDX abun da ke ciki bincike: nazarin tsarin kayan abu / lura da lahani, nazarin micro-yankin na al'ada na abun da ke ciki, daidaitaccen ma'auni na girman abun ciki, da dai sauransu.

Gwajin gwaji: Siginar lantarki a cikinICza a iya samun sauri da sauƙi ta hanyar micro-bincike.Laser: Ana amfani da micro-laser don yanke takamaiman yanki na guntu ko waya.

◆ EMMI Ganewa: EMMI ƙananan ƙananan ƙananan haske shine kayan aikin bincike mai inganci mai inganci, wanda ke ba da babban hankali da kuma hanyar wurin kuskure mara lalacewa.Yana iya ganowa da gano hasken haske mai rauni sosai (bayyane da kusa-infrared) da kama kwararan ruwa da lahani da lahani a sassa daban-daban.

Aikace-aikacen OBIRCH (gwajin canjin ƙima na Laser katako): OBIRCH ana amfani da shi sau da yawa don babban rashin ƙarfi da ƙima a ciki. ICkwakwalwan kwamfuta, da kuma nazarin hanyar zubewar layi.Yin amfani da hanyar OBIRCH, ana iya samun lahani a cikin da'irori yadda ya kamata, kamar ramuka a cikin layi, ramukan da ke ƙarƙashin ta ramuka, da manyan wuraren juriya a ƙasa ta ramuka.Ƙarin abubuwan da ke gaba.

◆ LCD allo zafi gano tabo: Yi amfani da LCD allo don gano tsarin kwayoyin halitta da kuma sake tsarawa a yayyo batu na IC, da kuma nuna wani tabo siffar daban-daban daga sauran yankunan karkashin na'ura mai kwakwalwa don nemo leakage batu (laifi mafi girma fiye da). 10mA) wanda zai damu da mai zane a cikin ainihin bincike.Kafaffen-point/non-kafaffen-point guntu niƙa: cire gwal ɗin gwal da aka dasa a kan Pad na guntun direban LCD, ta yadda Pad ɗin ba shi da lahani gaba ɗaya, wanda ke dacewa da bincike na gaba da sake haɗawa.

◆X-Ray gwaji mara lalacewa: Gano lahani iri-iri a ciki ICguntu marufi, kamar peeling, fashe, voids, wiring mutunci, PCB iya samun wasu lahani a cikin masana'antu tsari, kamar matalauta jeri ko bridging, bude da'irar, short circuit ko rashin lahani a cikin haši, amincin solder bukukuwa a cikin fakitoci.

◆SAM (SAT) gano aibi na ultrasonic ba zai iya gano tsarin da ke cikin baICguntu kunshin, da kuma yadda ya kamata gano daban-daban lalacewa lalacewa ta hanyar danshi da thermal makamashi, kamar O wafer delamination, Ya solder bukukuwa, wafers ko fillers Akwai gibi a cikin marufi, pores a cikin marufi kayan, daban-daban ramuka kamar wafer bonding saman. , ƙwallayen solder, filaye, da sauransu.