Halayen Samfur

Intel ya bayyana cikakkun bayanai na guntu 3D: mai iya tattara transistor biliyan 100, yana shirin ƙaddamarwa a cikin 2023

Chip ɗin 3D ɗin da aka tara shine sabon jagorar Intel don ƙalubalantar Dokar Moore ta hanyar tattara abubuwan dabaru a cikin guntu don haɓaka yawan CPUs, GPUs, da masu sarrafa AI.Tare da tsarin guntu yana kusa da tsayawa, wannan na iya zama hanya ɗaya tilo don ci gaba da haɓaka aiki.

Kwanan nan, Intel ya gabatar da sabbin bayanai game da ƙirar guntu ta 3D Foveros don guntuwar Tekun Meteor mai zuwa, tafkin Arrow, da guntuwar Lunar Lake a taron masana'antar semiconductor Hot Chips 34.

Jita-jita na baya-bayan nan sun nuna cewa Intel's Meteor Lake zai jinkirta saboda buƙatar canza tile / chipset na Intel na GPU daga kumburin TSMC 3nm zuwa kumburin 5nm.Duk da yake Intel har yanzu bai raba bayanai game da takamaiman kumburin da zai yi amfani da shi don GPU ba, wakilin kamfani ya ce kumburin da aka shirya don bangaren GPU bai canza ba kuma mai sarrafa na'urar yana kan hanya don sakin kan lokaci a 2023.

Musamman ma, wannan lokacin Intel kawai zai samar da ɗaya daga cikin sassa huɗu (bangaren CPU) da ake amfani da shi don gina guntun Meteor Lake - TSMC zai samar da sauran ukun.Majiyoyin masana'antu sun nuna cewa tile na GPU shine TSMC N5 (tsari na 5nm).

Intel ya raba sabbin hotuna na na'urar sarrafa Tekun Meteor, wanda zai yi amfani da kullin tsari na Intel's 4 (7nm process) kuma zai fara shiga kasuwa a matsayin na'ura mai sarrafa wayar hannu mai manyan cores guda shida da ƙananan cores biyu.Gilashin tafkin Meteor da Arrow Lake sun rufe bukatun kasuwannin PC na wayar hannu da tebur, yayin da za a yi amfani da tafkin Lunar a cikin litattafan rubutu na bakin ciki da haske, wanda ke rufe kasuwar 15W da ƙasa.

Ci gaba a cikin marufi da haɗin kai suna saurin canza fuskar na'urori na zamani.Dukansu yanzu suna da mahimmanci kamar fasahar kumburin tsari - kuma tabbas sun fi mahimmanci a wasu hanyoyi.

Yawancin bayanan Intel a ranar Litinin sun mayar da hankali kan fasahar tattara kayan aikin ta na 3D Foveros, wanda za a yi amfani da shi azaman tushen abubuwan sarrafa Tekun Meteor, Lake Arrow, da tafkin Lunar don kasuwar mabukaci.Wannan fasaha tana ba Intel damar tara ƙananan kwakwalwan kwamfuta a tsaye a kan guntun tushe mai haɗin kai tare da haɗin gwiwar Foveros.Intel kuma yana amfani da Foveros don Ponte Vecchio da Rialto Bridge GPUs da Agilex FPGAs, don haka ana iya la'akari da fasahar da ke da tushe don yawancin samfuran kamfanin na gaba.

A baya Intel ya kawo 3D Foveros zuwa kasuwa akan na'urorin sa na Lakefield masu ƙarancin girma, amma Tekun Meteor mai 4-tile da kusan 50-tile Ponte Vecchio sune guntu na farko na kamfanin da aka samar tare da fasaha.Bayan Arrow Lake, Intel zai canza zuwa sabon haɗin gwiwar UCI, wanda zai ba shi damar shigar da yanayin yanayin kwakwalwar kwakwalwar kwamfuta ta hanyar amfani da daidaitaccen dubawa.

Intel ya bayyana cewa zai sanya chipsets na Meteor Lake guda hudu (wanda ake kira "tiles/tiles" a cikin harshen Intel) a saman madaidaicin Layer na Foveros / tile tushe.Tile na tushe a tafkin Meteor ya bambanta da na Lakefield, wanda za'a iya la'akari da SoC a ma'ana.Fasahar marufi ta 3D Foveros kuma tana goyan bayan Layer na tsaka-tsaki mai aiki.Intel ya ce yana amfani da ingantaccen tsari na 22FFL mai rahusa da ƙarancin ƙarfi (daidai da Lakefield) don kera Layer Interposer na Foveros.Intel kuma yana ba da bambance-bambancen 'Intel 16' da aka sabunta na wannan kumburi don ayyukan ganowa, amma ba a bayyana wane nau'in tayal mai tushe na Meteor Lake Intel zai yi amfani da shi ba.

Intel za ta shigar da na'urorin lissafi, I/O blocks, SoC blocks, da graphics blocks (GPUs) ta amfani da Intel 4 tafiyar matakai a kan wannan tsaka-tsakin Layer.Duk waɗannan rukunin Intel ne suka tsara su kuma suna amfani da gine-ginen Intel, amma TSMC za ta OEM abubuwan I/O, SoC, da GPU a cikinsu.Wannan yana nufin cewa Intel zai samar da CPU da Foveros blocks kawai.

Majiyoyin masana'antu sun nuna cewa I/O mutu da SoC ana yin su ne akan tsarin N6 na TSMC, yayin da tGPU ke amfani da TSMC N5.(Yana da kyau a lura cewa Intel yana nufin tayal I / O azaman 'I / O Expander', ko IOE)

Nodes na gaba akan taswirar hanyar Foveros sun haɗa da filaye 25 da 18-micron.Intel ya ce har ma a ka'ida yana yiwuwa a cimma tazarar karo na 1-micron nan gaba ta amfani da Hybrid Bonded Interconnects (HBI).