Lantarki ic guntu Taimakawa Sabis na BOM TPS54560BDDAR sabbin kayan aikin ic kwakwalwan kwamfuta
Halayen Samfur
| TYPE | BAYANI |
| Kashi | Haɗin kai (ICs) Gudanar da Wutar Lantarki (PMIC) Masu Gudanar da Wutar Lantarki - Masu Gudanar da Canjawar DC DC |
| Mfr | Texas Instruments |
| Jerin | Yanayin Eco-™ |
| Kunshin | Tape & Reel (TR) Yanke Tape (CT) Digi-Reel® |
| SPQ | 2500T&R |
| Matsayin samfur | Mai aiki |
| Aiki | Mataki-Ƙasa |
| Kanfigareshan fitarwa | M |
| Topology | Buck, Rail Rail |
| Nau'in fitarwa | daidaitacce |
| Adadin abubuwan da aka fitar | 1 |
| Wutar lantarki - Input (min) | 4.5V |
| Wutar lantarki - Input (Max) | 60V |
| Voltage - Fitarwa (min / Kafaffen) | 0.8V |
| Wutar lantarki - Fitarwa (Max) | 58.8V |
| Yanzu - Fitowa | 5A |
| Mitar - Canjawa | 500kHz |
| Mai gyara aiki tare | No |
| Yanayin Aiki | -40°C ~ 150°C (TJ) |
| Nau'in hawa | Dutsen Surface |
| Kunshin / Case | 8-PowerSOIC (0.154", Nisa 3.90mm) |
| Kunshin Na'urar Mai bayarwa | 8-SO PowerPad |
| Lambar Samfurin Tushen | Saukewa: TPS54560 |
1.IC suna, fakitin ilimin gabaɗaya da ka'idojin suna:
Yanayin zafin jiki.
C = 0 ° C zuwa 60 ° C (darajar kasuwanci);I = -20 ° C zuwa 85 ° C (majin masana'antu);E = -40 ° C zuwa 85 ° C (tsara darajar masana'antu);A=-40°C zuwa 82°C (majin sararin samaniya);M=-55°C zuwa 125°C (jin soja)
Nau'in kunshin.
A-SSOP;B-CERQUAD;C-TO-200, TQFP;D-Ceramic saman jan karfe;E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-Ƙarancin DIP;N-DIP;Q PLCC;R - Ƙunƙarar yumbura DIP (300mil);S - TO-52, T - TO5, TO-99, ZUWA-100;U - TSSOP, uMAX, SOT;W - babban tsari na factor (300mil) W-w-babban tsari factor (mil 300);X-SC-60 (3P, 5P, 6P);Y- kunkuntar saman jan karfe;Z-TO-92, MQUAD;D-Mutuwa;/ PR-karfafa filastik;/W-Wafar.
Adadin fil:
a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;ina -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Q-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;V-8 (zagaye);W-10 (zagaye);X-36;Y-8 (zagaye);Z-10 (zagaye).(zagaye).
Lura: Harafin farko na suffix na haruffa huɗu na ajin dubawa shine E, wanda ke nufin cewa na'urar tana da aikin antistatic.
2.Haɓaka fasahar marufi
Abubuwan da aka haɗa na farko sun yi amfani da fakitin lebur ɗin yumbu, waɗanda sojoji suka ci gaba da amfani da su tsawon shekaru da yawa saboda amincinsu da ƙaramin girmansu.Ba da daɗewa ba fakitin da'ira na kasuwanci ya koma cikin fakitin layi biyu, yana farawa da yumbu sannan kuma filastik, kuma a cikin 1980s ƙidaya fil na da'irori na VLSI ya wuce iyakar aikace-aikacen fakitin DIP, a ƙarshe ya haifar da bullar fitin grid arrays da masu ɗaukar guntu.
Kunshin dutsen saman ya fito a farkon shekarun 1980 kuma ya zama sananne a cikin ƙarshen wancan shekaru goma.Yana amfani da fitin fil mafi kyawu kuma yana da siffar gull-wing ko siffar fil mai siffa J.Onearin da ke fitar da shi (SOIC), alal misali, yana da yanki 30-50% yanki kuma shine 70% ƙasa da daidai da daidai.Wannan fakitin yana da fitilun filaye masu siffar gull da ke fitowa daga dogayen ɓangarorin biyu da filin fil na 0.05 ".
Ƙaramin-Outline Integrated Circuit (SOIC) da fakitin PLCC.a cikin 1990s, kodayake har yanzu ana amfani da kunshin PGA don manyan microprocessors.PQFP da ƙananan ƙananan fakitin (TSOP) sun zama fakitin da aka saba don manyan na'urori masu ƙidayar fil.Manyan na'urori na Intel da AMD sun ƙaura daga fakitin PGA (Pine Grid Array) zuwa fakitin Land Grid Array (LGA).
Kunshin Grid Array ya fara bayyana a cikin 1970s, kuma a cikin 1990s an haɓaka kunshin FCBGA tare da ƙidayar fil fiye da sauran fakiti.A cikin fakitin FCBGA, ana jujjuya mutun sama da ƙasa kuma ana haɗa shi da ƙwallayen siyar da ke kan fakitin ta wani tushe mai kama da PCB maimakon wayoyi.A kasuwannin yau, marufi ma yanzu wani sashe ne na daban na tsarin, kuma fasahar kunshin kuma na iya shafar inganci da yawan amfanin samfurin.
