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1.Yadda ake yin wafer crystal guda ɗaya

Mataki na farko shine tsarkakewa na ƙarfe, wanda ya haɗa da ƙara carbon da canza silicon oxide zuwa silicon na 98% ko fiye da tsarki ta amfani da redox.Yawancin karafa, kamar ƙarfe ko tagulla, ana tace su ta wannan hanya don samun isasshen ƙarfe mai tsafta.Koyaya, 98% har yanzu bai isa ba don masana'antar guntu kuma ana buƙatar ƙarin haɓakawa.Sabili da haka, za a yi amfani da tsarin Siemens don ƙarin tsarkakewa don samun ingantaccen polysilicon mai tsabta da ake buƙata don tsarin semiconductor.
Mataki na gaba shine a ja lu'ulu'u.Na farko, babban tsaftataccen polysilicon da aka samu a baya yana narkar da shi don samar da silicon ruwa.Bayan haka, ana kawo kristal guda ɗaya na nau'in siliki a cikin hulɗa da saman ruwa kuma a hankali a ja sama yayin juyawa.Dalilin da ya sa ake bukatar iri guda na lu’ulu’u shi ne, kamar yadda mutum ya yi layi, ana bukatar a jera atom din silicon domin wadanda suka zo bayansu su san yadda ake yin layi daidai.A ƙarshe, lokacin da ƙwayoyin siliki suka bar saman ruwa kuma suka ƙarfafa, ginshiƙin silicon crystal ɗin da aka tsara da kyau ya cika.
Amma menene 8" da 12" ke wakilta?Yana magana ne game da diamita na ginshiƙin da muke samarwa, ɓangaren da ya yi kama da fensir bayan an yi masa magani kuma a yanka shi cikin ƙwanƙwasa sirara.Menene wahalar yin manyan wafers?Kamar yadda aka ambata a baya, tsarin yin wafers kamar yin marshmallows ne, juya su da kuma tsara su yayin da kuke tafiya.Duk wanda ya yi marshmallow a da, zai san cewa yana da matukar wahala a yi manya-manyan marshmallows masu kauri, haka nan kuma ga aikin ja da wafer, inda saurin juyawa da sarrafa zafin jiki ke shafar ingancin wafer.A sakamakon haka, girman girman, mafi girma da buƙatun saurin gudu da zafin jiki, yana sa ya fi wuya a samar da wafer mai inganci 12" fiye da wafer 8".

Don samar da walƙiya, ana amfani da abin yankan lu'u-lu'u don yanke waƙan a kwance a cikin waƙafi, waɗanda za a goge su don samar da wafern da ake buƙata don kera guntu.Mataki na gaba shine tara gidaje ko masana'anta.Yaya ake yin guntu?
2.Having an gabatar da abin da silicon wafers ne, kuma a fili yake cewa masana'anta IC chips kamar gina gida tare da Lego blocks, ta stacking su Layer a kan Layer don ƙirƙirar siffar da kake so.Koyaya, akwai matakai kaɗan don gina gida, kuma iri ɗaya ke kan masana'antar IC.Menene matakan da ke cikin kera IC?Sashe mai zuwa yana bayyana tsarin kera guntu IC.

Kafin mu fara, muna buƙatar fahimtar menene IC guntu - IC, ko Integrated Circuit, kamar yadda ake kira, tarin da'irori da aka kera waɗanda aka haɗa su cikin tsari.Ta yin wannan, za mu iya rage adadin yankin da ake buƙata don haɗa da'irori.Hoton da ke ƙasa yana nuna zane na 3D na da'ira na IC, wanda za a iya ganin an tsara shi kamar katako da ginshiƙan gida, an jera ɗaya a kan ɗayan, shi ya sa ake kwatanta masana'antar IC da gina gida.

Daga sashin 3D na guntu IC da aka nuna a sama, ɓangaren shuɗi mai duhu a ƙasa shine wafer ɗin da aka gabatar a sashin da ya gabata.Sassa masu launin ja da ƙasa sune inda aka yi IC.

Da farko, ana iya kwatanta ɓangaren ja da ɗakin bene na ƙasa na wani dogon gini.Harabar bene na ƙasa shine ƙofar ginin, inda ake samun damar shiga, kuma galibi yana da aiki ta fuskar sarrafa zirga-zirga.Don haka ya fi rikitarwa don ginawa fiye da sauran benaye kuma yana buƙatar ƙarin matakai.A cikin da'irar IC, wannan zauren shine layin ƙofar dabaru, wanda shine mafi mahimmancin ɓangaren IC gaba ɗaya, yana haɗa ƙofofin dabaru daban-daban don ƙirƙirar guntu IC mai cikakken aiki.

Bangaren rawaya kamar bene na al'ada.Idan aka kwatanta da bene na ƙasa, ba shi da rikitarwa kuma baya canzawa da yawa daga bene zuwa bene.Manufar wannan bene shine haɗa ƙofofin dabaru a cikin sashin ja tare.Dalilin da ya sa ake buƙatar yadudduka masu yawa shi ne cewa akwai da'irori da yawa da za a haɗa su tare kuma idan Layer guda ɗaya ba zai iya ɗaukar dukkanin da'irori ba, dole ne a tattara yadudduka da yawa don cimma wannan burin.A wannan yanayin, ana haɗa nau'ikan yadudduka sama da ƙasa don biyan buƙatun wayoyi.