Asalin IC XCKU025-1FFVA1156I Chip Integrated Circuit IC FPGA 312 I/O 1156FCBGA
Halayen Samfur
| TYPE | KYAUTA |
| category | Haɗin kai (ICs) |
| masana'anta | |
| jerin | |
| kunsa | girma |
| Matsayin samfur | Mai aiki |
| DigiKey mai shirye-shirye ne | Ba a tabbatar ba |
| Lambar LAB/CLB | 18180 |
| Adadin abubuwan dabaru/raka'a | 318150 |
| Jimlar adadin raƙuman RAM | Farashin 13004800 |
| Adadin I/Os | 312 |
| Voltage - Samar da wutar lantarki | 0.922V ~ 0.979V |
| Nau'in shigarwa | |
| Yanayin aiki | -40°C ~ 100°C (TJ) |
| Kunshin / Gidaje | |
| Kunshin ɓangaren mai siyarwa | 1156-FCBGA (35x35) |
| Lambar babban samfur |
Takardu & Mai jarida
| NAU'IN ARZIKI | MAHADI |
| Takardar bayanai | |
| Bayanin muhalli | Xiliinx RoHS Cert |
| Tsarin PCN / ƙayyadaddun bayanai |
Rarraba ƙayyadaddun muhalli da fitarwa
| SANARWA | KYAUTA |
| Matsayin RoHS | Mai bin umarnin ROHS3 |
| Matsayin Jijjiga Humidity (MSL) | 4 (72 hours) |
| Matsayin ISAR | Ba a ƙarƙashin ƙayyadaddun REACH ba |
| ECN | 3A991D |
| HTSUS | 8542.39.0001 |
Gabatarwar Samfur
Farashin FCBGA(Flip Chip Ball Grid Array) yana nufin "juya guntu ball Array".
FC-BGA(Flip Chip Ball Grid Array), wanda ake kira flip chip ball grid array tsarin kunshin, kuma shine mafi mahimmancin tsarin fakitin don kwakwalwan haɓakar hotuna a halin yanzu.An fara wannan fasahar tattara kayan ne a cikin shekarun 1960, lokacin da IBM ta kera fasahar da ake kira C4 (Controlled Collapse Chip Connection) domin hada manyan kwamfutoci, sannan ta kara bunkasa ta yin amfani da tashin hankali na narkakkar bututun don tallafawa nauyin guntu. da sarrafa tsayin kumburin.Kuma ya zama alkiblar ci gaban fasahar juyewa.
Menene fa'idodin FC-BGA?
Na farko, yana warwarewadaidaitawar lantarki(EMC) daTsangwama na lantarki (EMI)matsaloli.Gabaɗaya magana, siginar siginar guntu ta amfani da fasahar fakitin WireBond ana aiwatar da ita ta hanyar waya ta ƙarfe mai tsayi.A cikin yanayin mita mai yawa, wannan hanya za ta haifar da abin da ake kira tasirin impedance, yana haifar da cikas akan hanyar sigina.Koyaya, FC-BGA tana amfani da pellets maimakon fil don haɗa mai sarrafawa.Wannan kunshin yana amfani da jimlar ƙwallo 479, amma kowanne yana da diamita na 0.78 mm, wanda ke ba da mafi guntuwar haɗin waje.Yin amfani da wannan kunshin ba wai kawai yana samar da kyakkyawan aikin lantarki ba, amma kuma yana rage hasara da haɓakawa tsakanin abubuwan haɗin gwiwar sassan, yana rage matsalar tsangwama na lantarki, kuma yana iya jure wa mitoci mafi girma, karya iyakar overclocking ya zama mai yiwuwa.
Na biyu, yayin da masu zanen guntu nunin ke haɓaka da'irori masu yawa a cikin yanki ɗaya na silicon crystal, adadin shigarwa da tashoshi da fitilun za su ƙaru cikin sauri, kuma wata fa'idar FC-BGA ita ce tana iya haɓaka ƙimar I/O. .Gabaɗaya magana, ana shirya jagorar I/O ta amfani da fasahar WireBond a kusa da guntu, amma bayan kunshin FC-BGA, ana iya shirya jagoran I/O a cikin tsararru a saman guntu, yana samar da mafi girman I/O. layout, yana haifar da mafi kyawun amfani da inganci, kuma saboda wannan fa'ida.Fasahar juyewa tana rage yankin da kashi 30% zuwa 60% idan aka kwatanta da nau'ikan marufi na gargajiya.
A ƙarshe, a cikin sabon ƙarni na babban sauri, kwakwalwan nunin nuni sosai, matsalar rashin zafi zai zama babban kalubale.Dangane da nau'in fakitin juyawa na musamman na FC-BGA, bayan guntu za a iya fallasa shi zuwa iska kuma yana iya watsa zafi kai tsaye.A lokaci guda kuma, na'urar na iya inganta haɓakar zafi ta hanyar Layer na ƙarfe, ko shigar da ƙwanƙarar zafi na ƙarfe a bayan guntu, ƙara ƙarfafa ƙarfin zafi na guntu, kuma yana inganta kwanciyar hankali na guntu. a high-gudun aiki.
Saboda fa'idodin fakitin FC-BGA, kusan duk kwakwalwan kati na hanzarin hoto ana kunshe da FC-BGA.
