XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104
Bayanin samfur
| TYPENo.na Logic Blocks: | 2586150 |
| No. na Macrocells: | 2586150Macrocells |
| Iyalin FPGA: | Virtex UltraScale Series |
| Salon Harka Mai Ma'ana: | Farashin FCBGA |
| No. na Fil: | 2104 Pin |
| Lambar Makin Gudun Gudun: | 2 |
| Jimlar RAM Bits: | 77722 Kbit |
| Lambar I/O: | 778I/O's |
| Gudanar da Agogo: | MMCM, PLL |
| Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙira: | 922mV |
| Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙira: | 979mV |
| Wutar Lantarki na I/O: | 3.3V |
| Matsakaicin Aiki: | 725 MHz |
| Nisan samfur: | Virtex UltraScale XCVU9P |
| MSL: | - |
Gabatarwar Samfur
BGA yana nufinKunshin Grid Q Array.
Ƙwaƙwalwar ajiyar da fasahar BGA ke rufewa na iya ƙara ƙarfin ƙwaƙwalwar ajiya zuwa sau uku ba tare da canza ƙarar ƙwaƙwalwar ajiya ba, BGA da TSOP
Idan aka kwatanta da, yana da ƙarami ƙarami, mafi kyawun aikin zubar da zafi da aikin lantarki.Fasahar fakitin BGA ta haɓaka ƙarfin ajiya a kowane murabba'in inch, ta amfani da samfuran ƙwaƙwalwar fasahar fakitin BGA a ƙarƙashin wannan ƙarfin, ƙarar shine kashi ɗaya bisa uku na marufi na TSOP;Bugu da kari, tare da al'ada
Idan aka kwatanta da kunshin TSOP, kunshin BGA yana da sauri kuma mafi inganci hanyar kawar da zafi.
Tare da haɓaka fasahar haɗin gwiwar haɗin gwiwar, buƙatun buƙatun na haɗaɗɗun da'irori sun fi ƙarfi.Wannan shi ne saboda fasahar marufi yana da alaƙa da aikin samfurin, lokacin da mitar IC ta wuce 100MHz, hanyar marufi na gargajiya na iya haifar da abin da ake kira "Cross Talk• al'amarin, kuma lokacin da adadin fil na IC ya kasance. fiye da 208 Pin, hanyar marufi na gargajiya yana da matsala.Saboda haka, ban da amfani da marufi na QFP, yawancin manyan guntu na yau da kullun (kamar chips ɗin zane da kwakwalwan kwamfuta, da sauransu) ana canza su zuwa BGA (Ball Grid Array). PackageQ) fasahar marufi.Lokacin da BGA ya bayyana, ya zama mafi kyawun zaɓi don babban aiki, babban aiki, fakitin multi-pin kamar cpus da kuɗaɗen gada na kudu/North akan uwayen uwa.
Hakanan ana iya raba fasahar marufi ta BGA zuwa rukuni biyar:
1.PBGA (Plasric BGA) substrate: Gabaɗaya 2-4 yadudduka na kayan halitta da suka haɗa da allon multi-Layer.Intel jerin CPU, Pentium 1l
Chuan IV na'urori masu sarrafawa duk an tattara su a cikin wannan tsari.
2.CBGA (CeramicBCA) substrate: wato yumbu substrate, haɗin wutar lantarki tsakanin guntu da substrate yawanci juya-guntu ne.
Yadda ake shigar FlipChip (FC a takaice).Intel jerin cpus, Pentium l, ll Pentium Pro ana amfani da su
Wani nau'i na encapsulation.
3.Farashin FCBGA(FilpChipBGA) Substrate: Hard Multi-Layer Substrate.
4.TBGA (TapeBGA) substrate: The substrate ne kintinkiri taushi 1-2 Layer PCB kewaye hukumar.
5.CDPBGA (Carty Down PBGA) substrate: yana nufin ƙananan guntu guntu (wanda aka sani da yankin rami) a tsakiyar kunshin.
Kunshin BGA yana da fasali masu zuwa:
1) .10 An ƙara adadin fil, amma nisa tsakanin fil ya fi girma fiye da na marufi na QFP, wanda ke inganta yawan amfanin ƙasa.
2) .Ko da yake an ƙara yawan amfani da wutar lantarki na BGA, ana iya inganta aikin dumama wutar lantarki saboda tsarin waldawar guntu mai sarrafawa.
3).Jinkirin watsa siginar ƙarami ne, kuma an inganta mitar daidaitawa sosai.
4).A taro na iya zama coplanar waldi, wanda ƙwarai inganta AMINCI.
