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samfurori

Sabbin asali na asali IC kayan lantarki Kayan Wuta Ic Chip Support BOM Sabis TPS62130AQRGTRQ1

taƙaitaccen bayanin:


Cikakken Bayani

Tags samfurin

Halayen Samfur

TYPE BAYANI
Kashi Haɗin kai (ICs)

Gudanar da Wutar Lantarki (PMIC)

Masu Gudanar da Wutar Lantarki - Masu Gudanar da Canjawar DC DC

Mfr Texas Instruments
Jerin Motoci, AEC-Q100, DCS-Control™
Kunshin Tape & Reel (TR)

Yanke Tape (CT)

Digi-Reel®

SPQ 250T&R
Matsayin samfur Mai aiki
Aiki Mataki-Ƙasa
Kanfigareshan fitarwa M
Topology Baka
Nau'in fitarwa daidaitacce
Adadin abubuwan da aka fitar 1
Wutar lantarki - Input (min) 3V
Wutar lantarki - Input (Max) 17V
Voltage - Fitarwa (min / Kafaffen) 0.9V
Wutar lantarki - Fitarwa (Max) 6V
Yanzu - Fitowa 3A
Mitar - Canjawa 2.5MHz
Mai gyara aiki tare Ee
Yanayin Aiki -40°C ~ 125°C (TJ)
Nau'in hawa Dutsen Surface
Kunshin / Case 16-VFQFN Faɗakarwar Kushin
Kunshin Na'urar Mai bayarwa 16-VQFN (3x3)
Lambar Samfurin Tushen Saukewa: TPS62130

 

1.

Da zarar mun san yadda ake gina IC, lokaci ya yi da za mu bayyana yadda ake yin ta.Don yin cikakken zane tare da fenti mai fenti, muna buƙatar yanke abin rufe fuska don zane kuma sanya shi a kan takarda.Sa'an nan kuma mu fesa fenti daidai a kan takarda kuma cire abin rufe fuska lokacin da fenti ya bushe.Ana maimaita wannan akai-akai don ƙirƙirar tsari mai kyau da rikitarwa.An yi ni irin wannan, ta hanyar tara yadudduka a saman juna a cikin aikin rufe fuska.

Ana iya raba samar da ICs zuwa waɗannan matakai 4 masu sauƙi.Ko da yake ainihin matakan masana'anta na iya bambanta kuma kayan da ake amfani da su na iya bambanta, ƙa'idar gaba ɗaya ta kasance iri ɗaya.Tsarin ya ɗan bambanta da zane-zane, ta yadda ICs ana kera su da fenti sannan a rufe su, yayin da fenti ake fara rufewa sannan a fenti.An kwatanta kowane tsari a ƙasa.

Karfe sputtering: Karfe kayan da za a yi amfani da shi ana yayyafa shi daidai gwargwado a kan wafer don samar da fim na bakin ciki.

Aikace-aikacen Photoresist: An fara sanya kayan aikin hoto a kan wafer, kuma ta hanyar photomask (ka'idar photomask za a yi bayanin lokaci na gaba), hasken haske ya buga a kan ɓangaren da ba a so don lalata tsarin kayan aikin hoto.Ana wanke kayan da suka lalace da sinadarai.

Etching: Wafer silicon, wanda ba shi da kariya ta mai ɗaukar hoto, an yi shi da katako na ion.

Cire Photoresist: An narkar da ragowar photoresist ta amfani da maganin cirewa na hoto, don haka kammala aikin.

Sakamakon ƙarshe shine nau'ikan 6IC da yawa akan wafer guda ɗaya, waɗanda aka yanke kuma a aika su zuwa injin marufi don shiryawa.

2.Menene tsarin nanometer?

Samsung da TSMC suna fada da shi a cikin ci gaba na tsarin semiconductor, kowanne yana ƙoƙari ya fara farawa a cikin ginin don tabbatar da oda, kuma kusan ya zama fada tsakanin 14nm da 16nm.Kuma mene ne fa’ida da matsalolin da ragewar tsarin zai kawo?A ƙasa za mu ɗan yi bayanin tsarin nanometer.

Yaya ƙananan nanometer yake?

Kafin mu fara, yana da mahimmanci mu fahimci abin da nanometers ke nufi.A cikin sharuddan lissafi, nanometer yana da mita 0.00000001, amma wannan misali ne mara kyau - bayan haka, za mu iya ganin sifilai da yawa bayan ma'aunin adadi amma ba mu da ma'anar ainihin abin da suke.Idan muka kwatanta wannan da kaurin farcen yatsa, zai iya fitowa fili.

Idan muka yi amfani da na’urar tantance kaurin ƙusa, za mu ga cewa kaurin ƙusa ya kai kimanin mita 0.0001 (0.1 mm), wanda ke nufin idan muka yi ƙoƙarin yanke gefen ƙusa zuwa layi 100,000, kowane layi. yayi daidai da kusan 1 nanometer.

Da zarar mun san yadda ƙananan nanometer yake, muna buƙatar fahimtar dalilin raguwar tsarin.Babban manufar rage kristal shine don dacewa da ƙarin lu'ulu'u a cikin ƙaramin guntu don kada guntu ya zama babba saboda ci gaban fasaha.A ƙarshe, rage girman guntu zai sauƙaƙa shiga cikin na'urorin hannu da saduwa da buƙatun bakin ciki na gaba.

Ɗaukar 14nm a matsayin misali, tsarin yana nufin mafi ƙarancin yuwuwar girman waya na 14nm a guntu.


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